1. Compatible with dot dispensing and dip glue methods using pneumatic, piezoelectric, or screw valve configurations
2. Supports up to five dip glue heads with automatic switching. Modular configuration for epoxy, silver paste, and optional eutectic bonding processes
3. Autmatically switches between fourteen nozzles and five ejector pins to handle various chip/die sizes; supports both standard and flip-chip bonding for enhanced flexibility.
4. Multi-layer dispensing capability for complex workflows
5. Enhanced force control accuracy and stability: Central air-bearing structure eliminates friction; awarded an invention patent
6. Advanced vision alignment for accurate die placement on complex substrates
7. Friction-free air-bearing bonding head ensures stable and repeatable bonding force
8. Designed for cleanroom operation and continuous industrial use
Applicable Industries
Automotive Electronics, Medical Devices, Aerospace, Consumer Electronics, etc.
Flip-chip IC assembly and advanced semiconductor packaging
Optical modules such as VCSEL, photodiodes, and camera sensors
Power semiconductor modules and RF components
MEMS, sensor devices, and hybrid electro-optical packages
Automotive, industrial, medical, and communication electronics
Packaged Products
DC/AC Modules, Camera Chips, Infrared Chips, PD/VCSEL Chips, Holder Brackets, Lenses, etc
Specifications
| Item | PNP6600EVO | PNP6600advanced | PNP660OW |
| Product positioning | RF, microwave, multi-chip placement, and related fields | Optical modules, high-precision multi-chip placement, and related fields | Wafer-level placement, wafer-level sorting, and related fields |
| XY placement accuracy (calibration wafer | ±5μm@3σ | ±3μm@3σ | ±5μm@3σ |
| Rotation accuracy (calibration wafer) | ±0.1°@3σ | ±0.07°@3σ | ±0.05°@3σ |
| Efficiency (standard wafer) | CPH+10um:2500 CPH+5um:1000 | +10um CT:4.55~65 +5um CT:4.85~6.4s +3um CT:6.45~8.85 | CPH+10um:1150 CPH+5um: 950 |
| Supported chip size | 0.15-50mm | 0.15-50mm | 0.15-80mm |
| Supported bonding range | 300*200mm | 300*200mm | 330*330mm |
| Bondforce range | Optional 0.1N-10N, 0.5N-50N | Optional 0.1N-10N, 0.5N-50N | Optional 0.1N-10N, 0.5N-50N |
| Supported substrate types: | Lead-frame, Carrier, Boat, Substrate | Wafer ring, wafer, Lead-frame, Carrier, Boat, Substrate | Wafer ring, wafer, Lead-frame, Carrier, Boat, Substrate |
| Equipment weight | 2200kg | 2500kg | 2300kg |
| Equipment dimensions | 2720*1450*1700mm | 2720*1450*1700mm | 2720*1650*1700mm |
| Flip-chip | Optional | Optional | Standard |
| Flux dipping tray | Optional | Optional | Standard |
| Independent dispensing / glue dipping / spray dispensing | Optional | Optional optional | Optional |
| Bond head dispensing | Optional | Optional | / |
| Bond head UV | Optional | Optional | / |
| Automatic loading/unloading | Optional | Optional | Optional |
| Automatic changeover for 7/14 nozzles | Optional | Optional | Optional |
| Automatic ejector pin changeover | Optional | 2500kg | Optional |
FAQ
Q: What bonding materials are supported?
A: Epoxy resins, conductive silver pastes, eutectic solder (with optional reflow/eutectic kit), and standard adhesives — compatible with dot and dip dispensing modes.
Q: Can PNP 6600 EVO handle flip-chip and standard die bonding on the same line?
A: Yes — automatic nozzle/ejector switching and configurable process heads let you run both flip-chip and standard die workflows without major retooling.
Q: What accuracy can I expect for production?
A: The system is specified to ±5 μm at 3σ; actual accuracy depends on die size, substrate planarity and selected vision/fixturing options
